AEC-Q102與AEC-Q101有什么區(qū)別?

適用對象

對象：車用分立半導(dǎo)體元器件
  晶體管:BJT、MOSFET、IGBT
  二極管：Diodes、Rectifier、Zeners、PIN、Varactors
  光器件：LEDs、Optocoupler、Photodiodes、Phototransistors
     

對象：車用分立光電半導(dǎo)體元器件       
  Light Emitting Diodes、Laser Components、Photodiodes、Phototransistors
     

樣本量

環(huán)境應(yīng)力試驗：3lot×77pcs/lot
  LTPD(Lot Tolerance Percent Defective) = 1, 90%置信度的失效率為1%
     

環(huán)境應(yīng)力試驗：3lot×26pcs/lot
  LTPD (Lot Tolerance Percent Defective) = 3, 90%置信度的失效率為3%

失效判據(jù)

不符合規(guī)格書規(guī)定的電學(xué)和光學(xué)參數(shù)范圍
  環(huán)境試驗前后參數(shù)值變化未保持在±20%以內(nèi)；漏電未保持在5倍初始值以內(nèi)（對于濕氣試驗為10倍）
  由于環(huán)境試驗出現(xiàn)物理損壞
  如果失效原因被供應(yīng)商和用戶認(rèn)為是由于處理不當(dāng)或ESD的原因引起，這些失效可以被忽略，但應(yīng)呈現(xiàn)在報告中
     

不符合規(guī)格書規(guī)定的電學(xué)和光學(xué)參數(shù)范圍
  環(huán)境試驗前后參數(shù)值變化未保持在附錄5規(guī)定的±x%以內(nèi)
  由于環(huán)境試驗出現(xiàn)物理損壞（遷移、腐蝕、機械破壞、分層等）；有些物理損壞可能由供應(yīng)商和用戶同意認(rèn)為僅僅是外觀不良而不影響認(rèn)證結(jié)果；
  如果失效原因被供應(yīng)商和用戶認(rèn)為是由于處理不當(dāng)、測試板連接、ESD或其它跟測試條件無關(guān)的原因引起，這些失效可以被忽略，但應(yīng)呈現(xiàn)在報告中

應(yīng)力前后參數(shù)測試

高溫工作

施加最大偏置

5a HTOL1：最高允許工作溫度條件下施加一定的驅(qū)動電流使得結(jié)溫達到最高允許值
  5b HTOL2：為最大驅(qū)動電流條件下選擇工作溫度使得結(jié)溫達到最高允許值
  無需降額時，5a=5b

溫度循環(huán)

低溫-55℃，高溫為最高結(jié)溫（不超過150℃）

低溫-40℃，高溫根據(jù)焊點溫度調(diào)整

高溫高濕

Ta=85℃/85%RH，器件施加額定正向偏置

6a WHTOL1：雙85條件下施加一定的驅(qū)動電流使得結(jié)溫達到最高允許值，30min開/30min關(guān)
  6b WHTOL2：雙85條件下施加最小驅(qū)動電流、如無最小電流則施加不使結(jié)溫超3K的驅(qū)動電流

功率溫度循環(huán)

溫升≥100℃

低溫-40℃，高溫根據(jù)焊點溫度來定

DPA

從完成H3TRB或HAST、TC試驗的樣品中，每項隨機抽取2個樣品

完成功率溫度循環(huán)（PTC）/間歇工作壽命（IOL）、高溫高濕工作（WHTOL1、WHTOL2）/高溫高濕反偏（H3TRB）、硫化氫腐蝕（H₂S）、混合氣體腐蝕（FMG）試驗的樣品中隨機抽取2只/批

熱阻

JESD24-3（MOS），JESD24-4（BJT），JESD24-6（IGBT）

JESD51-50、JESD51-51、JESD51-52，針對LED

7

溫度循環(huán)Temperature Cycling

TC

1

DGU

77

3 Note B

0

JESD22 A-104 Appendix 6

1000 cycles(T_A=minimum range of -55℃ to maximum rated junction  temperature,not to exceed 150℃).Can reduce duration to 400 cycles using T_A(max)=25℃ over part maximum rated junction    temperature or   using T_A(max)=175℃ if the maximum rated   junction temperature is above 150℃.TEST before and   after TC

9a

高溫高濕High Temperature High Humidity Bias

HTHHB

1

DGUZ

77

3 Note B

0

JESD22 A-101

1000 hours at T_A=85℃/85%RH with part   Forward    biased.TEST before and after H3TRB as a minimum

10
        alt

功率溫度循環(huán)Power and Temperature Cycle

PTC

1

DGTUW

77

3 Note B

0

JESD22 A-105

Perform PTC if △T_J≥100℃ can    not be achieved with   IOL. Tested per duration indicated for timing    Requirements in   Table 2A.Parts Powered and Chamber cycled to insure    △T_J≥100℃(not   to exceed absolute maximum ratings).
  TEST before and after PTC as a minimum.

12

DPA Destructive Physical Analysis

DPA

1

DG

2

1 Note B

0

AEC-Q101-004 Section 4

Random sample of parts that have    successfully completed   H3TRB or HAST, and TC.

22

熱阻Thermal Resistance

TR

3

DG

10 each,pre-&post-change

1

0

JESD24-3,24-4,24-6 as appropriate

Measure TR to assure    specification compliance and provide   process change comparison data.

5b

高溫工作High Temperature Operating Life HTOL

HTOL2

D,G,X,Y

26

3 Note B

0

JEDEC JESD22-A108

Only for LED and Laser    Component
  Duration 1000 h at maximum Specified drive current,Choose corresponding      T_solder according to derating curve to achieve max Tj   defined in the part    specification.Test 5b is equivalent to 5a if   no derating.For use within    specical application; a longer test   duration my be needed to ensure    reliability over aplication   lifetime.For details,see Appendix    7a"Reliability Validation   for LEDs"
  Test before and after HTOL2

7

溫度循環(huán)Temperature Cycling

TC

D,G

26

3 Note B

0

JEDEC JESD22-A104

PC before TC
  Duration 1000 cycles.Minimum soak & dwell time 15 min.Minimum      temperature as specified in part specification. Choose TC condition   exceeding    or equal to the operating temperature according to the   apporopriate part    specification:
  TC condition 1:max T_solder=85℃
  TC condition 2:max T_solder=100℃
  TC condition 3:max T_solder=110℃
  TC condition 4:max T_solder=125℃
  TC condition and tranfer time shall be mentioned    in the test   report.
  It is recommended to  decapsulate the    part after TC and   perform WBP if applicable.Report data.The supplier has to      provide explanation in case that WBP cannot be performed.
  TEST before and after TC.

6a

高溫高濕Wet High Temperature Operating Life

WHTOL1

D,G,X,Y

26

3 Note B

0

JEDEC JESD22-A101

Only for LED and Laser    Component
  PC before WHTOL1
  Duration 1000 h at T_solder=85℃/85%RH      with drive current according to derating curve to    achieve   max Tj defined in the part specification.Operated with power cycle 30 min on   /30 min off
  Test before and after WHTOL1,DPA after WHTOL1

6b

高溫高濕Wet High Temperature Operating Life

HTOL2

D,G,X,Y

26

3 Note B

0

JEDEC JESD22-A101

Only for LED and Laser    Component
  PC before WHTOL2
  Duration 1000 h at T_solder=85℃/85%RH with   minimum drive current according    to part specification.If no   minimum rated drive  current is specified, a drive current shall      be chosen not  to exceed a rise of 3K    for T_junction.
  Test before and after WHTOL2,DPA after WHTOL2

8a

功率溫度循環(huán)Power Temperature Cycling

PTC

D,G,X,Y

26

3 Note B

0

JEDEC JESD22-A105

Only for LED and Laser    Component
  PC before PTC
  Duration 1000 temperature cycles with drive current according to   derating    curve to achieve max Tj specified in part   specification.
  Operated with power cycle 5 min on/ 5 min off.
  Minimum temperature as specified in part specification. For maximum      temperature choose:
  PTC condition 1:max T_solder=85℃
  PTC condition 2:max T_solder=105℃
  PTC condition 3:max T_solder=125℃
  PTC condition should be chosen closest to the    operating temperature   range within the appropriate part specification. PTC    condtion   shall be mentioned in the test report. For use within special      application; a longer test duration may be needed to ensure reliability      over  application liftime.For    details.see Appendix   7a "Reliability Validation for LEDs"
  TEST before and after PTC.DPA after PTC.

11

DPA Destructive Physical Analysis

DPA

D,G

2(for each test)

1 Note B

0

Appendix 6

Random sample of parts that have    successfully completed   PTC/IOL.WHTOL/H3TRB,H₂S,and FMG(2 samples each)

24

熱阻Thermal Resistance

TR

D,G,X,Y

10 each,pre-&post-change

1

0

JEDEC
    JESD51-50
    JESD51-51
    JESD51-52

Measure thermal resistance    according to JESD51-50,   JESD51-51,and     JESD51-52 to assure specification   compliance.