SPEC與領(lǐng)先的存儲制造商簽署底部凸起式金屬電鍍設(shè)備供貨協(xié)議

　　半導(dǎo)體表面制備與處理設(shè)備供應(yīng)商SPEC近日宣布公司的Suffix電鍍系統(tǒng)將被一家領(lǐng)先的DRAM和NAND閃存制造商用于鈀淀積工藝。Suffix系統(tǒng)將在SEMICON China中在4722號展位由WESI Technology展出。

　　“我們的工程師現(xiàn)在對某些關(guān)鍵工藝進(jìn)行深入研究，SPEC內(nèi)部研發(fā)路圖在戰(zhàn)略上與未來的成功緊密結(jié)合。”SPEC銷售和市場主管Robin Douglas說道。

　　SPEC SIGNS AGREEMENT FOR UNDERBUMP METAL PLATING EQUIPMENT WITH MAJOR MEMORY SUPPLIER

　　Valencia, California March 12, 2009 Semiconductor Processing Equipment Corp, (SPEC) an experienced supplier of surface preparation and finishing equipment used in the production of semiconductors, hard disc and medical devices announced that it has successfully completed negotiations with a leading DRAM and NAND memory maker naming its SuffixTM plating system as Tool of Record for palladium deposition. The Suffix is being presented at Semicon China in Booth No.4722 by WESI Technology.

　　“SPEC has been working diligently toward this important milestone for several years,” said Robin Douglas, Director of Sales and Marketing for SPEC. “Both corporations benefit from a close relationship in this very competitive market segment. The User’s Group has the opportunity to share results and advanced process applications, telling us exactly what their goals are. Our engineers now gain insight into key processes allowing targeting of resources where needed. The internal research and development roadmap at SPEC becomes strategically aligned for future success.”

　　The SuffixTM automatic electroless plating system for underbump metallization uniformly deposits palladium or gold over nickel in more production fabs than any other batch tool. Low Cost-of-Ownership and high throughput make electroless plating the preferred choice for cost reductions in price sensitive applications. Consistent uptime and extreme uniformity are benefits derived from Spec’s two decades of experience. The tools are flexible, automatically handling multiple diameters of wafers with tailored recipes at contract packagers as well as the highest volume 300mm fabs. Users enjoy freedom to select chemistries from all suppliers with confidence, knowing the SPEC exclusive recipe management software will adjust to their satisfaction. Integrated analytical equipment tracks metal content triggering precise injections to extend solution usefulness.