新聞中心

EEPW首頁(yè) > 測(cè)試測(cè)量 > 業(yè)界動(dòng)態(tài) > 通富微電測(cè)試技術(shù)

通富微電測(cè)試技術(shù)

作者: 時(shí)間:2022-04-18 來(lái)源:通富微電 收藏

20200907092541_87497.jpg 

本文引用地址:http://m.butianyuan.cn/article/202204/433191.htm

Production Overview

        TFME offers various WBBGA and WBLGA package based on customer different requirement.




Features
- 1.1x0.7 mm to 21x21 mm Package
- 0.2mm to 1.0mm C Mold Chase
- 01005 Components SMT
- 0.3x0.3 mm Small Die 
- 1-6 Layer Substrate


Process Capability & Design Rule


Reliability Test Standards



Shipment Packing









關(guān)鍵詞: 封裝 測(cè)試 通富微電

評(píng)論


相關(guān)推薦

技術(shù)專(zhuān)區(qū)

關(guān)閉